Arrangement for sealing a spigot of a cooling plate of a battery pack assembly, comprises an adapter defined by a lip and a web section, where the lip is configured to be mounted in fluid communication with the cooling channels
	ASHISH D; KUMAR K A; NITHYANANDAN K P; BABU J V V; DINESH G
	2023-08-09
专利权人	MAHINDRA & MAHINDRA LTD (MAHI-C)
申请日期	2023-08-09
专利号	IN202341053461-A
成果简介	NOVELTY - The arrangement has an adapter defined by a lip and a web section, where the lip is mounted in fluid communication with one of cooling channels. The web section extends from the lip in an operative vertical direction with respect to a cooling plate. A top plate has a through-hole, where the top plate is configured to abut the adapter such that an axis of the through- hole aligns with a mounting axis of web section. A spigot is defined by an upper section, a lower section and a flange section adjoining the upper section and the lower section. USE - Arrangement for sealing spigot of cooling plate of battery pack assembly. Can also be used in other types of cooling plates of battery packs. ADVANTAGE - The arrangement eliminates radial clearances between the spigots and the top plate, accommodates variations in spigot construction while maintaining a tight seal to prevent dust and moisture entry, and is convenient to assemble. The arrangement provides an adaptor that reduces or eliminates clearances that permit the ingress of dust, moisture or contaminants into the cooling plate, thus preventing damage to the battery module. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for sealing spigot.
IPC 分类号	H01M-010/613 ; H01M-010/625 ; H01M-010/647 ; H01M-010/6554 ; H01M-050/20
国家	印度
专业领域	能源矿产
语种	英语
成果类型	专利
文献类型	科技成果
条目标识符	http://119.78.100.226:8889/handle/3KE4DYBR/20909
专题	中国科学院新疆生态与地理研究所
作者单位	MAHINDRA & MAHINDRA LTD (MAHI-C)
推荐引用方式 GB/T 7714	ASHISH D,KUMAR K A,NITHYANANDAN K P,et al. Arrangement for sealing a spigot of a cooling plate of a battery pack assembly, comprises an adapter defined by a lip and a web section, where the lip is configured to be mounted in fluid communication with the cooling channels. IN202341053461-A[P]. 2023.

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