Method of making boards on substrates from aluminum nitride ceramics and can be used in electronic
	SIDOROV V A; CHUPRUNOV A G; GRISHAEVA A S; SIDOROV K V
	2023-08-31
专利权人	PULSAR RES & PRODN ENTERPRISE STOCK CO (PULS-Non-standard)
申请日期	2023-08-31
专利号	RU2828329-C1
成果简介	NOVELTY - Invention relates to production of metal coatings on substrates from aluminum nitride ceramics and can be used in electronic, electrical and radio engineering industries. Disclosed is a method of producing a metallized aluminum nitride-based ceramic substrate with an adhesive layer. Adhesive layer consists of titanium nitride and alloy of silver, copper and titanium. After photolithographic formation of a metallization pattern, a layer of aluminum nitride ceramic containing inclusions of materials of an adhesive layer is removed by etching in alkaline solutions. USE - Various technological processes. ADVANTAGE - Invention enables to manufacture metallized ceramic boards based on aluminum nitride ceramics, in which, after formation of topological pattern of metallization, possibility of overgrowing of electrically insulating gaps during subsequent operations of chemical and electrochemical coating of boards is excluded. 2 cl, 1 tbl
IPC 分类号	H05K-003/06
国家	俄罗斯
专业领域	材料科学
语种	英语
成果类型	专利
文献类型	科技成果
条目标识符	http://119.78.100.226:8889/handle/3KE4DYBR/20576
专题	中国科学院新疆生态与地理研究所
作者单位	PULSAR RES & PRODN ENTERPRISE STOCK CO (PULS-Non-standard)
推荐引用方式 GB/T 7714	SIDOROV V A,CHUPRUNOV A G,GRISHAEVA A S,et al. Method of making boards on substrates from aluminum nitride ceramics and can be used in electronic. RU2828329-C1[P]. 2023.

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