| Method of making boards for hybrid microassemblies involves anodizing the surface of the metal base | |
| 2024-03-19 | |
| 专利权人 | PRECISION INSTR RES INST STOCK CO (PREC-Non-standard) |
| 申请日期 | 2024-03-19 |
| 专利号 | RU2828284-C1 |
| 成果简介 | NOVELTY - Invention relates to electrical engineering, radio engineering, electronics and microwave engineering and can be used in the technology of manufacturing microwave elements of hybrid microassemblies. Method includes anodizing the surface of the metal base, removing the anode layer in the points of contact of the circuit elements with the metal base, metallization of the anodized base, formation of the circuit pattern by cutting of metallization along the closed circuit board elements, after which anodic etching of the film structure located outside the circuit board elements circuit is performed. USE - Electrical engineering; radio engineering. ADVANTAGE - Wider frequency zone of operation of hybrid microassemblies, providing good heat removal and reliable grounding, high quality of the printed circuit board due to the absence of the need to perform topology formation by photolithography. 1 cl |
| IPC 分类号 | H05K-001/00 |
| 国家 | 俄罗斯 |
| 专业领域 | 材料科学 |
| 语种 | 英语 |
| 成果类型 | 专利 |
| 文献类型 | 科技成果 |
| 条目标识符 | http://119.78.100.226:8889/handle/3KE4DYBR/17652 |
| 专题 | 中国科学院新疆生态与地理研究所 |
| 作者单位 | PRECISION INSTR RES INST STOCK CO (PREC-Non-standard) |
| 推荐引用方式 GB/T 7714 | BOBIN N A,VOLKOV S M,GORNOSTAEV I N,et al. Method of making boards for hybrid microassemblies involves anodizing the surface of the metal base. RU2828284-C1[P]. 2024. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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