Non-woven gasket for removing heat from powerful semiconductor devices, has part of spirals made of copper wire, where gasket is made of non-woven material made from spirals of elastic steel wire wound into spiral
2024-03-25
专利权人PULSAR RES & PRODN ENTERPRISE STOCK CO (PULS-Non-standard)
申请日期2024-03-25
专利号RU228756-U1
成果简介NOVELTY - The gasket has a part of spirals made of copper wire, where the gasket is made of non-woven material made from spirals of elastic steel wire wound into the spiral, stretched to a pitch equal to diameter of the spiral, and pressed under a pressure of 800-1100 kilogram-force per square centimeter. The steel spirals are made of EI-708A-VI steel, where the number of copper wire spirals is 25-40% of the number of steel spirals. The copper wire is coated with gold. The wire of the spirals made of steel and copper includes a diameter of 0.09 millimeters. USE - Non-woven gasket for removing heat from powerful semiconductor devices operating under harsh operating conditions. ADVANTAGE - The gasket can be used in products operating under harsh operating conditions. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a non-woven gasket.
IPC 分类号H05K-007/00
国家俄罗斯
专业领域材料科学
语种英语
成果类型专利
文献类型科技成果
条目标识符http://119.78.100.226:8889/handle/3KE4DYBR/17559
专题中国科学院新疆生态与地理研究所
作者单位
PULSAR RES & PRODN ENTERPRISE STOCK CO (PULS-Non-standard)
推荐引用方式
GB/T 7714
SIDOROV V A,KRYMKO M M,CHUPRUNOV A G,et al. Non-woven gasket for removing heat from powerful semiconductor devices, has part of spirals made of copper wire, where gasket is made of non-woven material made from spirals of elastic steel wire wound into spiral. RU228756-U1[P]. 2024.
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