METHOD FOR PREPARATION AND HEAT TREATMENT OF DISPERSION-STRENGTHENED COMPOSITIONS OF PASTES FOR COPPER-CERAMIC NITRIDE, OXIDE AND CARBIDE BOARDS OF POWER ELECTRONICS
	SHAYDULLIN R I
	2024-04-01
专利权人	SHAYDULLIN R I (SHAY-Individual)
申请日期	2024-04-01
专利号	RU2833556-C1
成果简介	NOVELTY - Invention relates to production of microelectronic components. Method for preparation and heat treatment of dispersion-strengthened compositions of pastes for copper-ceramic nitride, oxide and carbide boards of power electronics includes preparation of paste and heat treatment, wherein powders of copper and active additive are mixed in ball mill with ceramic grinding bodies for mechanochemical activation of powder surface, then a paste-like composition is obtained by adding to the powder a diluent-wetting agent, a plasticiser and a binder in amount of 4 to 15 wt.%, paste is applied with thickness of 10 to 60 mcm on both sides of ceramic material of boards with thickness of 320 to 1,000 mcm, which is conjugated on both sides with oxygen-free annealed sheet of copper with thickness of 0.3 to 1.0 mm, then a hardening additive is formed from the formed phase of chemical compounds corresponding to the ceramic material of boards and intermetallic compounds with sheet and powdered copper, which are agglomerated into particles with size of 10 to 50 nm, spaced from each other in the range of distances from 100 to 500 nm, by heat treatment at residual pressure from 1⋅10-4 to 1⋅10-5 mm Hg and variable heat treatment time. USE - Microelectronics. ADVANTAGE - Invention provides formation of copper-ceramic boards of high reliability with low electric conductivity of dielectric ceramics, with good heat conductivity and high mechanical strength. 10 cl, 1 tbl, 6 ex
IPC 分类号	C23C-028/02 ; H01L-023/15
国家	俄罗斯
专业领域	材料科学
语种	英语
成果类型	专利
文献类型	科技成果
条目标识符	http://119.78.100.226:8889/handle/3KE4DYBR/17426
专题	中国科学院新疆生态与地理研究所
作者单位	SHAYDULLIN R I (SHAY-Individual)
推荐引用方式 GB/T 7714	SHAYDULLIN R I. METHOD FOR PREPARATION AND HEAT TREATMENT OF DISPERSION-STRENGTHENED COMPOSITIONS OF PASTES FOR COPPER-CERAMIC NITRIDE, OXIDE AND CARBIDE BOARDS OF POWER ELECTRONICS. RU2833556-C1[P]. 2024.

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