| Method of preparing a fluoroplastic surface for metallization applying a copper layer involves treating | |
| 2024-04-18 | |
| 专利权人 | UNIV URALS (UYUR-C) |
| 申请日期 | 2024-04-18 |
| 专利号 | RU2829704-C1 |
| 成果简介 | NOVELTY - Invention relates to electronic engineering, in particular, to preparation of fluoroplastic surface for metallization. Method of preparing the surface of fluoroplastic for applying a copper layer involves treating its surface at 80-85 °C in Dash etching solution (HF : HNO3 : CH3COOH = 1:3:1) with washing with distilled water 60-70 °C, treatment in 10 % tin (II) chloride solution SnCl2 , followed by washing with distilled water with temperature of 40-50 °C, subsequent treatment in 1 M solution of thiourea (NH2)2CS at room temperature and chemical deposition of a conducting layer of Cu2S in a preliminary prepared reaction mixture containing 3×10-2 mol/l CuSO4, 2.0 mol/l CH3COONa, 1.6×10-2 mol/l (NH2)2CS, for 60-120 min at pH 5.35-5.40 and process temperature 80 °C. During subsequent application of copper layer with thickness of about 30 mcm by galvanic method on prepared surface of fluoroplastic, the measured adhesion strength of its adhesion to fluoroplastic was equal to 1.4-1.8 kg/cm. USE - Electronic equipment. ADVANTAGE - High reliability and quality of articles on fluoroplastic substrates. 1 cl, 5 ex |
| IPC 分类号 | C08J-007/043 ; C23C-014/20 ; H05K-003/38 |
| 国家 | 俄罗斯 |
| 专业领域 | 材料科学 |
| 语种 | 英语 |
| 成果类型 | 专利 |
| 文献类型 | 科技成果 |
| 条目标识符 | http://119.78.100.226:8889/handle/3KE4DYBR/17112 |
| 专题 | 中国科学院新疆生态与地理研究所 |
| 作者单位 | UNIV URALS (UYUR-C) |
| 推荐引用方式 GB/T 7714 | MASKAEVA L N,BALDINA M O,MARKOV V F,et al. Method of preparing a fluoroplastic surface for metallization applying a copper layer involves treating. RU2829704-C1[P]. 2024. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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