| Method of manufacturing multilayer rigid-elastic printed circuit board which rigid parts | |
| 2024-05-30 | |
| 专利权人 | MOSC INST ELECTRONIC TECHNOLOGY NAT RES (MOEL-Soviet Institute) |
| 申请日期 | 2024-05-30 |
| 专利号 | RU2830530-C1 |
| 成果简介 | NOVELTY - Invention relates to the field of electrical engineering, namely to a method of producing combined boards, in which rigid parts are connected to each other by an elastic loop. In the manufacturing method, it includes the operations of etching copper foil-clad polyimide by a liquid method and polyimide by a reactive-ionic method to achieve the width of the polyimide paths of meander shape greater than the width of the copper conductors, which contributes to lower mechanical stresses in conducting lines during deformations and necessary limitation of extensibility to preserve their electrical integrity. For high rate of metal etching with minimum lateral undergrowth, solution of 160-240 ml of deionised water, 120-180 ml of hydrogen peroxide, 15-25 g of sulphamic acid and 2.5-4.5 ml of hydrochloric acid is used. Reactive ion etching of polyimide takes place in a medium containing oxygen, argon and SF6 gas with flow rates of 0.9-1.1 l/h, 0.8-1.2 l/h, 0.5-0.6 l/h, respectively, through the copper mask with the help of steel tooling, which provides the clamping force and additional heat removal. After forming the topology of the internal signal layers of the printed circuit board, an elastic train is created by applying and curing an elastic material with thickness of 300-800 mcm and an adhesion activator for a metal of the silane group. Connection of elastic loop with formed meander topology in foil-clad polyimide with rigid parts of board from glass fibre is performed by pressing. USE - Electrical engineering. ADVANTAGE - Creation of a rigidly elastic printed circuit board with high mechanical resistance to stretching, compression, bending and twisting. 1 cl, 2 dwg |
| IPC 分类号 | H05K-001/02 ; H05K-003/06 ; H05K-003/46 |
| 国家 | 俄罗斯 |
| 专业领域 | 材料科学 |
| 语种 | 英语 |
| 成果类型 | 专利 |
| 文献类型 | 科技成果 |
| 条目标识符 | http://119.78.100.226:8889/handle/3KE4DYBR/16485 |
| 专题 | 中国科学院新疆生态与地理研究所 |
| 作者单位 | MOSC INST ELECTRONIC TECHNOLOGY NAT RES (MOEL-Soviet Institute) |
| 推荐引用方式 GB/T 7714 | VERTYANOV D V,GORLOV N S,ZHUMAGALI R N,et al. Method of manufacturing multilayer rigid-elastic printed circuit board which rigid parts. RU2830530-C1[P]. 2024. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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