Device for obtaining digital image of semiconductor wafers, has torque transmission gears which are fixed on electric motor shaft and on scissor mechanism shaft, and damping mechanism which contains spring elements which are located in corners of plate clamping mechanism table
2024-06-03
专利权人INNOVISION LLC (INNO-Non-standard)
申请日期2024-06-03
专利号RU231035-U1
成果简介NOVELTY - The device has a housing (1), the longitudinal movement carriages, torque transmission gears (8), and a high-resolution scanner (10). A mechanism is provided for pressing the wafer to the scanning plane, and includes an electric motor (6) and a damping mechanism which is mounted on a scissor lift. The wafer pressing mechanism, the electric motor, and the damping mechanism are mounted on a scissor lift (7). The torque transmission gears are fixed on the electric motor shaft and on the scissor mechanism shaft, and the damping mechanism contains four spring elements which are located in the corners of the plate clamping mechanism table. USE - Device for obtaining digital image of semiconductor wafers. ADVANTAGE - The small defects on the plates are accurately detected. The image quality is degraded due to glare and flare from backlight sources. The quality of the resulting digital image of microelectronic product crystals on a semiconductor wafer is increased thus reducing the risk of the damage. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic general view of the system for forming a digital image of semiconductor wafers. 1Housing 6Electric motor 7Scissor lift 8Torque transmission gear 10High-resolution scanner
IPC 分类号G01N-021/88 ; H01L-021/66 ; H04N-023/68
国家俄罗斯
专业领域信息技术
语种英语
成果类型专利
文献类型科技成果
条目标识符http://119.78.100.226:8889/handle/3KE4DYBR/16445
专题中国科学院新疆生态与地理研究所
作者单位
INNOVISION LLC (INNO-Non-standard)
推荐引用方式
GB/T 7714
VASILCHENKO D V,ROMASHENKO M A,PUKHOV D A,et al. Device for obtaining digital image of semiconductor wafers, has torque transmission gears which are fixed on electric motor shaft and on scissor mechanism shaft, and damping mechanism which contains spring elements which are located in corners of plate clamping mechanism table. RU231035-U1[P]. 2024.
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