| LED module has polymer layer that is provided with phosphors of color, where central hole is made in heat-dissipating substrate, and LEDs are located closer to outer portion of heat-dissipating substrate than to central hole of heat-dissipating substrate | |
| 2024-06-23 | |
| 专利权人 | KRASNOZNAMENSKY PLANT SEMICONDUCTOR DEVI (KRAS-Non-standard) |
| 申请日期 | 2024-06-23 |
| 专利号 | RU228977-U1 |
| 成果简介 | NOVELTY - The module (1) has a round heat-dissipating substrate (3) made of metal with low thermal resistance. An electrically insulating heat-conducting material is provide with low thermal resistance to facilitate heat dissipation through the heat-dissipating substrate with low thermal resistance. A polymer layer is provided with phosphors of color. A central hole (4) is made in the heat-dissipating substrate, and LEDs (2) are located closer to outer portion of the heat-dissipating substrate than to the central hole of the heat-dissipating substrate. The polymer layer is made in form of an optical system of a separate LED. The polymer layer is made in form of an optical system of all LEDs of the LED module. The central hole is designed with possibility of connection to a heat-dissipating device or heat pipe. USE - LED module. ADVANTAGE - The efficiency of heat removal from LEDs and the dissipation of the removed heat into the surrounding space is increased. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of the LED module. 1LED module 2LED 3Heat-dissipating substrate 4Central hole |
| IPC 分类号 | F21V-029/503 ; H01L-033/64 |
| 国家 | 俄罗斯 |
| 专业领域 | 材料科学 |
| 语种 | 英语 |
| 成果类型 | 专利 |
| 文献类型 | 科技成果 |
| 条目标识符 | http://119.78.100.226:8889/handle/3KE4DYBR/16138 |
| 专题 | 中国科学院新疆生态与地理研究所 |
| 作者单位 | KRASNOZNAMENSKY PLANT SEMICONDUCTOR DEVI (KRAS-Non-standard) |
| 推荐引用方式 GB/T 7714 | KRIVENKOV A L,SMIRNOV I A. LED module has polymer layer that is provided with phosphors of color, where central hole is made in heat-dissipating substrate, and LEDs are located closer to outer portion of heat-dissipating substrate than to central hole of heat-dissipating substrate. RU228977-U1[P]. 2024. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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