LED module for light-signaling and lighting systems, has rectangular heat-dissipating substrate for accommodating LEDs and made of metal with low thermal resistance and insulating heat-conducting material with low thermal resistance
2024-06-24
专利权人KRASNOZNAMENSKY PLANT SEMICONDUCTOR DEVI (KRAS-Non-standard)
申请日期2024-06-24
专利号RU228529-U1
成果简介NOVELTY - The LED module (1) has a rectangular heat-dissipating substrate (3) for accommodating LEDs (2). The substrate is made of metal with low thermal resistance and electrically insulating heat-conducting material with low thermal resistance. The polymer layer is being made with phosphors of color. Two openings are made in the substrate. An area of the substrate is greater than 10 times greater than an area of the LED located on the substrate. A polymer layer is made in form of an optical system of a separate LED. The polymer layer is made in form of an optical system of the LEDs of the LED module. USE - LED module for light-signaling and lighting systems. ADVANTAGE - The LED module increases efficiency of heat removal from the LEDs and dissipation of the removed heat into the surrounding space. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of an LED module with an LED. 1LED module 2LEDs 3Rectangular heat-dissipating substrate 4Holes
IPC 分类号H01L-025/075
国家俄罗斯
专业领域材料科学
语种英语
成果类型专利
文献类型科技成果
条目标识符http://119.78.100.226:8889/handle/3KE4DYBR/16126
专题中国科学院新疆生态与地理研究所
作者单位
KRASNOZNAMENSKY PLANT SEMICONDUCTOR DEVI (KRAS-Non-standard)
推荐引用方式
GB/T 7714
KRIVENKOV A L,SMIRNOV I A. LED module for light-signaling and lighting systems, has rectangular heat-dissipating substrate for accommodating LEDs and made of metal with low thermal resistance and insulating heat-conducting material with low thermal resistance. RU228529-U1[P]. 2024.
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