Development of transition joint of copper-stainless steel (SS) used in cryogenics, electric space vehicles, defense, high pressure pipelines, vacuum systems, comprises dissimilar metal of Electrolytic tough Pitch Copper (ETP-Cu) and austenitic stainless steel pipe are joint by friction weld (FW)
	DOSHI B R; MEHTA K P; VYAS H D; BADHEKA V J
	2024-07-05
专利权人	UNIV PANDIT DEENDAYAL ENERGY (UYPA-Non-standard)
申请日期	2024-07-05
专利号	IN202421051646-A
成果简介	NOVELTY - Development of transition joint of copper-stainless steel (SS) comprises dissimilar metal of Electrolytic Tough Pitch Copper (ETP-Cu) and austenitic stainless steel (SS304L) pipe are joint by friction weld (FVV). USE - Development of transition joint of copper-stainless steel (SS) used in cryogenics, electric space vehicles, defense, high pressure pipelines, vacuum systems. ADVANTAGE - The sound joints between dissimilar pipe materials of Cu-SS are established with evidence of resistance to leak at room temperature and after cryogenic shock test quality joint is received very which is challenging because of wall thickness to diameter ratio is < 1. The mechanisms and properties of dissimilar copper-SS FW joints are elucidated through mechanical and metallurgical analysis. The Cu -SS pipe joint received excellent strength which is more than 70% of base materials of copper. The weld continuity in the periphery of pipe configuration is observed at four different locations.
IPC 分类号	B05C-005/02 ; B23K-103/00 ; E21B-033/12 ; E21B-041/00 ; H01M-004/66
国家	印度
专业领域	材料科学
语种	英语
成果类型	专利
文献类型	科技成果
条目标识符	http://119.78.100.226:8889/handle/3KE4DYBR/15946
专题	中国科学院新疆生态与地理研究所
作者单位	UNIV PANDIT DEENDAYAL ENERGY (UYPA-Non-standard)
推荐引用方式 GB/T 7714	DOSHI B R,MEHTA K P,VYAS H D,et al. Development of transition joint of copper-stainless steel (SS) used in cryogenics, electric space vehicles, defense, high pressure pipelines, vacuum systems, comprises dissimilar metal of Electrolytic tough Pitch Copper (ETP-Cu) and austenitic stainless steel pipe are joint by friction weld (FW). IN202421051646-A[P]. 2024.

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