METHOD OF MANUFACTURING MONOLITHIC MICROWAVE INTEGRATED CIRCUIT includes forming on the front side of the semiconductor substrate a part of active and passive elements
2024-09-16
专利权人ISTOK SCI & PROD ENTERPRISE STOCK (ISTO-Non-standard)
申请日期2024-09-16
专利号RU2835783-C1
成果简介NOVELTY - Invention relates to the technology of manufacturing microelectronic devices. Method of manufacturing a monolithic integrated circuit of the microwave range includes forming on the front side of the semiconductor substrate a part of active and passive elements, thinning of semiconductor substrate from reverse side to required thickness in two stages, formation of other part of elements on reverse side of semiconductor substrate, formation of through holes by means of plasma-chemical etching in two stages, formation of metal coating on surface of walls of through holes and free surface of semiconductor substrate. Thinning of the semiconductor substrate from the back side in two steps: at first stage, mechanical grinding is carried out with grinding powder based on aluminium oxide Al2O3, and at the second stage – chemical-mechanical polishing with a polishing suspension containing titanium dioxide, sodium hypochlorite and deionised water. USE - Electricity. ADVANTAGE - Reducing the cost of the technological process of the method of making a monolithic microwave integrated circuit while maintaining the required values of electrophysical parameters. 4 cl, 1 dwg, 1 tbl
IPC 分类号H01L-021/70 ; H01L-021/77
国家俄罗斯
专业领域材料科学
语种英语
成果类型专利
文献类型科技成果
条目标识符http://119.78.100.226:8889/handle/3KE4DYBR/15137
专题中国科学院新疆生态与地理研究所
作者单位
ISTOK SCI & PROD ENTERPRISE STOCK (ISTO-Non-standard)
推荐引用方式
GB/T 7714
ZAKHAROV A N,OREKHOVA O A,KRASNIK V A,et al. METHOD OF MANUFACTURING MONOLITHIC MICROWAVE INTEGRATED CIRCUIT includes forming on the front side of the semiconductor substrate a part of active and passive elements. RU2835783-C1[P]. 2024.
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