Three-dimensional coupling model is employed to optimize pumping power and heat removal in microchannel heat sink with various design configurations
	BALASUBRAMANIAN K; NANDY A K
	2024-12-17
专利权人	VIGNANS FOUND SCI TECHNOLOGY & RES (VIGN-Non-standard)
申请日期	2024-12-17
专利号	IN202441100103-A
成果简介	NOVELTY - A three-dimensional coupling model is employed to optimize pumping power and heat removal in a microchannel heat sink with various design configurations. USE - Three-dimensional coupling model. ADVANTAGE - The coupling model has effect of design parameters, such as different geometric configurations for solid/porous walls, porous layer thickness, stepwise porosity arrangements, porous wall wavelength, and slurry fusion temperature, which are evaluated for pressure drop, heat transfer and performance evaluation factor (PEF).
IPC 分类号	A61L-027/56 ; B32B-027/32 ; C04B-038/00 ; G06F-119/08 ; G06F-030/23
国家	印度
专业领域	材料科学
语种	英语
成果类型	专利
文献类型	科技成果
条目标识符	http://119.78.100.226:8889/handle/3KE4DYBR/14023
专题	中国科学院新疆生态与地理研究所
作者单位	VIGNANS FOUND SCI TECHNOLOGY & RES (VIGN-Non-standard)
推荐引用方式 GB/T 7714	BALASUBRAMANIAN K,NANDY A K. Three-dimensional coupling model is employed to optimize pumping power and heat removal in microchannel heat sink with various design configurations. IN202441100103-A[P]. 2024.

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